ENIAC SE2A webpage (public)

 


FORTH (GR)

NCSR D / IMEL (GR)

BHE (H)

BME (H)

MFA (H)

WESZTA (H)

Boschman TE (NL)

M2i (NL)

NXP Semiconductors (NL)
Project Leader

TNO (NL)

ITE (PL)

WRUT (PL)

INESC-ID (PT)

INESC-MN (PT)

INOV (P)

IMT (RO)

VTEC (S)

OPT (S)

SP (S)

Welcome to the ENIAC SE2A webpage

Nanoelectronics for Safe, Fuel Efficient and Environment Friendly Automotive Solutions

  

pdf

Current Technical Annex 2011
pdf         SE2A Report S1-2011
pdf
SE2A Report S2-2011 
 New
pdf         Brochure Outcome SE2A New
pdf 
Final Report Publishable Summary
 New
pdf
Final Report Use and Dissemination
 New


Demonstration Day Helmond Nov. 22nd 2012


   
   Demonstrators
Nr. Title Cooperative Partners
D 01 True Ground Speed Sensor VTEC, FORTH, OPT, SP, IMT, BHE, INESC-ID
D 02 Knowledge Framework NXP, TNO, M2i
D 03 Vibration and pressure monitoring system WRUT, ITE, M2i, VTEC, BTE, NXP, WESZTA
D 04 Tyre integrated shear force sensor WESZTA, MFA, TNO, BTE, BHE
D 05 Integrated Inertia Navigation System INOV, INESC-MN, INESC-ID
D 06 Gas flow system NCSR D / IMEL, BTE,
D 07 IC circuit for sensors INESC-ID, INESC-MN (SILICONGATE)
D 08 Advanced encapsulation technology BTE, NCSR D / IMEL
D 09 eHorizon TNO, INOV, TU/e
D 10 CO2 prediction tool TNO, NCSR D / IMEL, WRUT
D-A Gas Sensor IMT, FORTH
D-B Direction dependent flow sensor MFA, WESZTA
D-C Humidity Sensor BME
D-D Gas Sensor MFA, WESZTA


   Other SE2A Developments      

WP 2-1 Magnetoresistive Magnetometers for Application as Electronic Compasses INESC, MN, INESC-ID, INOV
WP 2-2 Piezoresistive 3D Si Force Sensor MFA, WESZTA, TNO
WP 2-3 Capacitive pressure sensor MFA, WESZTA
WP 2-4 SUNRED: a fast electro-thermal field solver for complex MEMS structures BME
WP 2-5 Design for thermal testability in LED applications BME
WP 2-6 Microwave Movement Estimation BHE
WP 2-7 Digital Compass with tilt compensation INESC, MN, INESC-ID, INOV
WP 2-8 RF Sub systems, Integrated Circuit Implementation - High performance on chip RF co-planar waveguides on Si: RF shielding by a local porous Si thick film (IMEL) NCSR D / IMEL
WP 3-1 Multi-Criteria Decision Making DfX Framework TNO
WP 3-2 Influence of PDMS contamination on adhesion properties of die-epoxy interface TNO, NXP
WP 3-3 Thermal degradation of epoxy moulding compounds (EMC) due to high temperature operating - Change of mechanical and chemical properties NXP
WP 3-4 Characterization of Intermetallic Compounds in Cu-Al Ball Bondpads NXP, TNO
WP 3-5 Develop cost effective test strategies for reliability monitoring including fast and effective feedback loop TNO, NXP
WP 3-6 Non destructive Failure Analysis Technique for Advanced Packaging M2i
WP 3-7 Board level interconnect reliability for automotive electronics TNO, NXP

        In case of questions please contact Harry Thewissen
                              

Project summary     

The social need for a transport infrastructure based upon the availability of safe, fuel-efficient and environmental-friendly cars is clearly recognized by the European citizens and the European Commission. The fulfilment of this ambition is not to be taken for granted, as it requires the development of a host of automotive technologies, systems, software and tools. The target parameters defined in the ENIAC Strategic Research Agenda for 2011 are:
  • Reduction of the annual socio - economic cost caused by road accidents
  • Improvement of fuel consumption efficiency
  • Reduction of CO2 emissions
The goals of this ENIAC SE2A project are in line with these target parameters by
  • making it possible to reduce the socio-economic costs by 1-2% annually
  • enhancing reliability and lifetime predictability to a level of zero ppm and 95% accuracy by the end of 2011
  • contributing to the realisation of improving the fuel efficiency by another 5-10% by the end of 2011, by developing 5-10 types of sensors.
  • developing 5-10 types of sensors, enabling the achievement of CO2 reduction targets
The project will be executed by a consortium incorporating European industrial, institutional and academic players in the field of R&D and innovation for automotive applications. It has 21 partners, located in 7 European countries. As such, it constitutes a new team with the best qualifications for the job.

  

Proposal number: 12009

 Acronym:  SE2A

Duration of the project (months):

 36

Date of end of negotiation

 05/12/2008

Project start date:

 01/01/2009

 

 

 
edited 02/04/2012  by Patrick Rostam-Khani / Harry Thewissen - NXP Semiconductors